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Ground-breaking ceremony ceremony for the Innovation Park for Artificial Intelligence (IPAI) in
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Ground-breaking ceremony ceremony for the Innovati...

Taiwanese chip manufacturer TSMC is building a new ESMC chip factory in Dresden together with
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Taiwanese chip manufacturer TSMC is building a new...

Winfried Kretschmann (Greens), Minister-President of Baden-Württemberg. portrait at the lectern
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Winfried Kretschmann (Greens), Minister-President ...

Harry Mergel (SPD), Lord Mayor of Heilbronn. ground-breaking ceremony ceremony for the Artificial
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Harry Mergel (SPD), Lord Mayor of Heilbronn. groun...

Prof. Reinhold R. Geilsdörfer, CEO of the Dieter Schwarz Foundation. ground-breaking ceremony
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Prof. Reinhold R. Geilsdörfer, CEO of the Dieter S...

Interview with Rolf Schumann, Chief Digital Officer at the Schwarz Group. Schwarz Digits is the
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Interview with Rolf Schumann, Chief Digital Office...

Ground-breaking ceremony ceremony for the Innovation Park for Artificial Intelligence (IPAI) in
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Ground-breaking ceremony ceremony for the Innovati...

Cameraman at an event with the Federal Chancellor. The journalists wear an armband with the federal
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Cameraman at an event with the Federal Chancellor....

Federal Chancellor Friedrich Merz (CDU) . Portrait at the lectern with free text space.
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Federal Chancellor Friedrich Merz (CDU) . Portrait...

From left, architect Jacob van Rijs, OB Harry Mergel, Digital Minister Dr. Karsten Wildberger,
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From left, architect Jacob van Rijs, OB Harry Merg...

Dr. Karsten Wildberger (CDU), Minister of Digital Affairs. ground-breaking ceremony ceremony for
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Dr. Karsten Wildberger (CDU), Minister of Digital ...

Ground-breaking ceremony ceremony for the Innovation Park for Artificial Intelligence (IPAI) in
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Ground-breaking ceremony ceremony for the Innovati...

Entry in the Golden Book of the City of Heilbronn: Federal Chancellor Friedrich Merz, Lord Mayor
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Entry in the Golden Book of the City of Heilbronn:...

Ground-breaking ceremony ceremony for the Innovation Park for Artificial Intelligence (IPAI) in
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Ground-breaking ceremony ceremony for the Innovati...

Winfried Kretschmann (Greens), Minister-President of Baden-Württemberg. portrait at the lectern
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Winfried Kretschmann (Greens), Minister-President ...

Dr. Nicole Hoffmeister-Kraut (CDU), Minister of Economics BW. ground-breaking ceremony ceremony for
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Dr. Nicole Hoffmeister-Kraut (CDU), Minister of Ec...

Moritz Gräter, CEO of IPAI. ground-breaking ceremony ceremony for the Artificial Intelligence
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Moritz Gräter, CEO of IPAI. ground-breaking ceremo...

Winfried Kretschmann (Greens), Minister-President of Baden-Württemberg. Step away from the lectern.
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Winfried Kretschmann (Greens), Minister-President ...

Roundtable discussion. From left, Mayor Harry Mergel, Minister of Economics BW Nicole
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Roundtable discussion. From left, Mayor Harry Merg...

Federal Chancellor Friedrich Merz (CDU) . Step away from the lectern. ground-breaking ceremony
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Federal Chancellor Friedrich Merz (CDU) . Step awa...

Ground-breaking ceremony ceremony for the Innovation Park for Artificial Intelligence (IPAI) in
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Ground-breaking ceremony ceremony for the Innovati...

The Taiwanese chip manufacturer TSMC is building a new ESMC chip factory in Dresden together with
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The Taiwanese chip manufacturer TSMC is building a...

The Taiwanese chip manufacturer TSMC is building a new ESMC chip factory in Dresden together with
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The Taiwanese chip manufacturer TSMC is building a...

The Taiwanese chip manufacturer TSMC is building a new chip factory in Dresden together with Bosch,
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The Taiwanese chip manufacturer TSMC is building a...

The Taiwanese chip manufacturer TSMC is building a new chip factory in Dresden together with Bosch,
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The Taiwanese chip manufacturer TSMC is building a...

Infineon Technologies AG is a German semiconductor manufacturer. The company is headquartered in
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Infineon Technologies AG is a German semiconductor...

Infineon Technologies AG is a German semiconductor manufacturer. The company is headquartered in
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Infineon Technologies AG is a German semiconductor...

Infineon Technologies AG is a German semiconductor manufacturer. The company is headquartered in
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Infineon Technologies AG is a German semiconductor...

The Taiwanese chip manufacturer TSMC is building a new chip factory in Dresden together with Bosch,
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The Taiwanese chip manufacturer TSMC is building a...

Werne, North Rhine-Westphalia, Germany, Ground-breaking ceremony for OGE's H2 training line in
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Werne, North Rhine-Westphalia, Germany, Ground-bre...

Infineon Technologies AG is a German semiconductor manufacturer. The company is headquartered in
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Infineon Technologies AG is a German semiconductor...

Infineon Technologies AG is a German semiconductor manufacturer. The company is headquartered in
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Infineon Technologies AG is a German semiconductor...

The Taiwanese chip manufacturer TSMC is building a new chip factory in Dresden together with Bosch,
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The Taiwanese chip manufacturer TSMC is building a...

DEGES is currently building the 172n federal road as a southern bypass of Pirna, starting from the
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DEGES is currently building the 172n federal road ...

DEGES is currently building the 172n federal road as a southern bypass of Pirna, starting from the
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DEGES is currently building the 172n federal road ...

Foot on spade
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Foot on spade